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Area Array Interconnection Handbook
Area Array Interconnection Handbook
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Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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3D Microelectronic Packaging: From Architectures to Applications
3D Microelectronic Packaging: From Architectures to Applications
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Graphene and VLSI Interconnectsby Cher-Ming Tan
Graphene and VLSI Interconnectsby Cher-Ming Tan
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